Laser Processing Case Study 3: Introduction to Hole Processing in Ceramics
I would like to introduce examples of hole processing in alumina and SUS.
Laser Processing Examples 3. Hole Processing in Ceramics *Photos are also included in the PDF catalog. Please download and check. [Example] Material: Alumina Hole Diameter: 50μ Pitch: 0.25mm Using a 400W fiber laser from Furukawa Electric, hole processing has been performed on 0.65T alumina.
- Company:ナラサキ産業 メカトロソリューション部 機能材料課
- Price:Other